Designing high-power parallel arrays with PRMs
Non-isolated Bus Architecture (NBA) is an evolution from IBA necessitated by data center and supercomputing systems. Our converters provide high-efficiency conversion in small packages. Designers can use these converters to integrate 12V loads into new 48V infrastructure or introduce new 48V capabilities into existing 12V infrastructures.
Non-isolated derivative to a standard DCM dedicated to 48V to 12V conversion in data center, automotive, and industrial markets
VIEW PRODUCTS
Input:
40 – 60V
Output:10 – 13.5V
Power:750W
Efficiency:Up to 97.3%
Dimensions:
3717 SM-ChiP
36.7 x 17.3 x 7.42mm
Factorized Power for Data Center Applications
VIEW PRODUCTS
Input:
38 – 60V
Output:0 – 2.3V
Power:Up to 200W
Efficiency:Up to 97% efficiency
Dimensions:
0823 ChiP
22.83 x 8.52 x 4.5mm
1323 ChiP
13.49 x 22.5 x 4.5mm
LGA SiP:
10 x 14 x 2.5mm
Pre- and post-transformation regulators
VIEW PRODUCTS
Input:
48V (36 – 75V)
Output:48V (5 – 55V)
Power:Up to 600W
Efficiency:Up to 97%
Dimensions:
Full Chip
32.5 x 22 x 6.73mm
Half Chip
22 x 16.5 x 6.73mm
12V, 24V or 48V direct to point-of-load regulators
VIEW PRODUCTS
Input:
12VIN nominal (8 to 18VIN)
24VIN nominal (8 to 42VIN)
48VIN nominal (30 to 60VIN)
Wide output range (1 to 16V)
Current:Up to 22A
Efficiency:Up to 98%
Light load and full load high efficiency performance
Dimensions:
LGA SiP
10 x 14 x 2.56mm
BGA SiP
10.5 x 14.5 x 3.05mm
10.5 x 10.5 x 3.05mm
GQFN
7.0 x 8.0 x 0.85mm
Wide range direct to point-of-load regulators with -55°C to +115°C operation
VIEW PRODUCTS
Input:
8 – 60V
Output:10 – 54V
Power:Up to 200W continuous
Efficiency:Over 98% efficiency
at >800 kHz FSW
Dimensions:
LGA SiP
10 x 14 x 2.5mm
BGA SiP
10.5 x 14.5 x 3.05mm (tin-lead available)
and
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Output specifications:
Output
Power Seminar
Expert-led workshops to boost your power conversion knowledge, spring 2020
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